Compliant with the following conditions:
- Leaded quantity of product below 100 ppm
- Lead-free process
Soldering conditions
Shape |
Symbol |
Hand Soldering |
DIP Soldering |
Reflow Soldering |
---|---|---|---|---|
Lead Frame & |
|
1. Temp. at tip of iron: 400°C Max.
2. Soldering time: 3. Distance: 3 mm Min. (from solder joint to case) |
1. Preheat temp. : 100°C Max. 2. Bath temp.: 265°C Max. 3. Bath time: 5 sec Max. 4. Distance: 3 mm Min. (from solder joint to case) |
No |
SMD Type |
|
1. Temp. at tip of iron: 350°C Max.
2. Soldering time: |
1. Preheat temp. :
2. Bath temp.: 3. Bath time: 5 sec |
1. Preheat temp. :
2. Operating temp.: Above 230°C, 3. Peak temp.: 260°C Max., 10 sec Max. |